AMAOE QU-5 Qualcomm CPU & RAM BGA Reballing Stencil

Name: AMAOE QU-5 Qualcomm CPU & RAM BGA Reballing Stencil
Brand: AMAOE
SKU: QU-5
Availability: InStock

₹179.00

Brand: AMAOE

Model: QU-5

Availability: In Stock

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Description
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Product Description

AMAOE QU-5 Qualcomm CPU & RAM BGA Reballing Stencil

The AMAOE QU-5 is a BGA reballing stencil designed for mobile phone motherboard repair. It supports selected Qualcomm processor and RAM IC layouts, helping technicians apply solder balls accurately during chip-level rework.

Supported Chipsets and ICs

SDM845 CPU and RAM
SM8150 CPU and RAM
SDM670
SDM710
MSM8917
SM6150

Product Features

Designed for Qualcomm CPU and RAM BGA reballing applications.
Suitable for mobile motherboard chip-level repair work.
Helps align solder balls with the corresponding IC pad layout.

Package Contents

1 × AMAOE QU-5 BGA Reballing Stencil

Note: Verify the IC marking and ball layout before use to ensure compatibility with the QU-5 stencil.

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🚚 Shipping & Delivery Information

UToolsZone Fast & Reliable Delivery

When you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

📦 Estimated Delivery Time

Total delivery time = Processing Time + Shipping Time

📦 Processing Time

Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

Shipping time refers to the duration your package takes to travel from our warehouse to your address.

🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.